The following is an analysis of the causes of ICT test blind spots by ICT test equipment manufacturers.
1. When the resistor is connected in parallel with the jumper, the resistor cannot be measured
2. The inductor (or transformer, relay) connected in parallel with the jumper cannot be measured.
3. The wrong part of the inductor is the jumper or short circuit, and it cannot be tested.
4. Small capacitors are connected in parallel with small resistors, and small capacitors cannot be measured.
5. Inductors are connected in parallel with resistors or capacitors and other components. Resistors or other components cannot be measured.
6. Diodes are connected in parallel in the same direction, and one of the missing components or empty soldering cannot be detected.
7. Components connected in parallel with small resistors cannot be measured.
8. The capacitance of the capacitor is too small, and the test is usually inaccurate.
9. The internal performance of ICs, crystal oscillators, adjustable resistors (VRs), thermistors, surge absorbers, and other components cannot be measured or cannot be accurately tested.
10. Diodes and transistors are connected in parallel with large capacitors, and diodes and transistors cannot be measured.
11. The high and low points of the components are in the same short-circuit group, and these components cannot be tested.
12. During the IC empty soldering test, if the pin of the tested IC and the capacitor are connected in parallel, the pin cannot be tested if it is disconnected.
13. A small capacitor is connected in parallel with a large capacitor (C1//C2), and the small capacitor cannot be measured. Generally speaking, the capacitance of C2 is more than 10 times that of C1. C1 is unpredictable.
